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Development Platform Chip Design Structure Library ·Chip functionalization structure library: including mechanical/gas pressure driven structure library, centrifugal driven structure library and surface tension driven structure library, reagent immobilization and release structure library, as well as chip interface and fixture structure library, which are selected and integrated according to fluid properties, target flow and flux, liquid separation/distribution/mixing/transfer and other fluid control requirements and chip form (card, disc and cartridge) requirements. ·Chip structure simulation: Through chip structure simulation, the advantageous structure can be quickly screened for processing testing and optimization. Material Library
·We have our own library of plates, membranes, adhesives, special materials and auxiliary materials of different categories and models. We screen and evaluate matching cost-effective materials based on product usage conditions and positioning, reagent methodology compatibility, etc. ·Thermoplastic polymers: PMMA, PC, PP, PS, COC, COP, Flexdym ·Silicon-based materials: silicon, glass, quartz ·Metal material: aluminum, stainless steel ·Thermosetting polymer: PDMS ·Paper-based materials ·Bulk doping or surface modification materials: hydrophilicity, hydrophobicity, functional groups, patterning.  Reagent Platform
·Reagent capsule platform: soft plastic capsule, hard plastic capsule, aluminum capsule to meet the storage needs of reagents with different chemical and physical properties. ·Dry reagent platform: reagent vitrification, in-situ freeze-drying, freeze-dried microspheres and reagent packaging on the chip to improve reagent stability and storage resistance, and improve product integration and ease of operation. ·Chip modification and modification platform: Ultra-micro-spotting instrument meets the needs of pL-μL protein array spotting, local hydrophilic and hydrophobic modification, chemical functional group modification, protein fixation and sealing process to meet the needs of chip surface modification and modification Processing platform ·We have mature rapid processing equipment and processes for the processing of different materials, covering PDMS chip processing systems, PMMA chip processing systems and silicon-based chip processing systems. ·Rapid prototyping: hot pressing, laser engraving, CNC engraving, photolithography, casting polymerization, film cutting and other rapid processing equipment. ·Engineering and mass production molding: mold development and injection molding equipment. ·Bonding assembly: laser welding, ultrasonic welding, thermal welding, hot press bonding, double-sided adhesive bonding, solvent-assisted bonding, pressure-sensitive adhesive bonding equipment. Testing and quality inspection platform ·High depth of field microscopy system, fully automatic image measuring instrument, digital microscope and other precision measuring equipment to meet the needs of micron-level high-precision dimensional measurement; ·Optical testing, precision fluid function control, pressure testing, sealing testing, surface hydrophilicity and hydrophobicity testing, aging testing equipment, etc., to meet the functional quality control needs of products. Equipment modular development platform ·Fluid control module: centrifugal, micro pump and micro valve
·Temperature control module: constant temperature, variable temperature
·Photoelectric detection module: absorbance, fluorescence, electro/chemiluminescence, image/color, electrochemical sensor signal acquisition, processing and transmission module |
Contact Us
Contact: Dr. Judy King Tel: 13656671373
Email: jdq@tinkerbio.com
Address: No. 198 Qidi Road, Xiaoshan District, Hangzhou City, Zhejiang Province
Room 1707, Building E, Hangzhou Bay Information Port
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